The underfill adhesives are mainly used for semiconductor packaging which distributes the mechanical stress at the joint which happens due to the modification in the thermal expansion factors. These are classified into two types such as Single Component Underfill Adhesives, and Two-Component Underfill Adhesives. These are widely used in various applications such as Ball Grid Arrays, Chip Scale Packaging, and Land Grid Arrays.
The global underfill adhesives market is expected to witness sustained growth over the forecast period. The continuous technological advancements in electronic industry will propel the global underfill adhesives market. Also, the increase in focus of manufacturers on next-generation, high reliability electronic applications will positively influence the market growth. In addition to that, the increase in demand for underfill adhesives in several packaging techniques which include ball grid arrays, chip scale packaging, and land grid arrays is expected to drive the global underfill adhesives market growth during this forecast period. Moreover, the rise in research and development to develop fast curing underfill which provide essential interconnect protection from vibration, shock, and drop. In addition to that, leading key players are collaborating with online distribution platforms to raise the uptake of underfill materials.
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The fluctuation in the cost of underfill adhesives is major restraint is expected to hamper the global underfill adhesives market growth over the forecast period.
The Global Underfill Adhesives Market is segmented into type, application, and region
On the basis of type, the global underfill adhesives market is segmented into type Single Component Underfill Adhesives, and Two-Component Underfill Adhesives.
On the basis of application, the global underfill adhesives market is segmented into Ball Grid Arrays, Chip Scale Packaging, and Land Grid Arrays.
On the basis of region, the global underfill adhesives market is segmented into five regions such as North America, Latin America, Europe, Asia Pacific, and Middle East & Africa.
Market Key Players
Various key players are discussed in global underfill adhesives market are Henkel, Panacol, Darbond Technology, Master Bond, AI Technology, Lord Corporation, Epoxy International, Buhnen,, and H.B. Fuller.
- Single Component Underfill Adhesives
- Two-Component Underfill Adhesives
- Ball Grid Arrays
- Chip Scale Packaging
- Land Grid Arrays
- North America
- Latin America
- Asia Pacific
- Middle East & Africa
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