The Thermal Interface Material Industry report provides a basic overview of the market including definitions, classifications, applications and industry chain structure. The Thermal Interface Material Market analysis is provided for the international market including development history, competitive landscape analysis, and major regions’ development status.
The rise in the market of thermal interface material is primarily due to the advancement of technology with the increase in the utilization of the internet of things and the increase in demand for sophisticated electronics across various industries. Due to sustainability, many automotive manufacturers prefer electronic vehicles that will again increase the demand for thermal interface materials. Moreover, with the increasing trend of automation, industries are incorporating more and more electrical and electronic devices. Hence thermal management has become more and more important, which is another key factor for the growth in demand for thermal interface materials in the near future. The global thermal interface market is also set to benefit from rapid population growth and increasing urbanization along with increasing disposable income, which is driving the growth of consumer electronics. Furthermore, advancement in the medical industry is also expected to support the growth of the global thermal interface materials market.
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Thermal Interface Material is a material that has high thermal conductivity and acts as an interface medium for dissipating heat generated from a heat source to the sink. It is used in the form of a secondary thermally conductive material that substitutes the thermally insulating air and the void between the surfaces. The dissipation of heat is crucial in order to maintain longevity and reliability of semiconductor and electronic devices. Hence, thermal interface materials play a significant role in the electronics industry, owing to their efficient heat transferring property. They are widely used for enhancing heat transfer in electronic components such as CPU, hard disks, graphic cards, chipsets, LED, microprocessors, IC packaging, etc. Several types of materials are used as thermal interface materials.
The Global Thermal Interface Material Market is segmented on the basis of type and application. On the basis of type the market is segmented into greases & adhesives, tapes & films, gap fillers, metal-based thermal interface materials, phase change materials, and others. On the basis of application the market is segmented into computers, telecom, medical devices, industrial machinery, consumer durables, automotive electronics, and others.
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the thermal interface material market based on various segments. It also provides market size and forecast estimates from the year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America. The thermal interface material market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.
The “Global Thermal Interface Material Market Analysis to 2028” is a specialized and in-depth study of the food and beverages industry with a special focus on the global market trend analysis. The report aims to provide an overview of the thermal interface material market with detailed market segmentation by type, application and geography. The thermal interface material market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading thermal interface material market players and offers key trends and opportunities in the market.
Parker Hannifin Corp
Henkel Adhesives Technologies
Honeywell International Inc
Kitagawa Industries America, Inc
The Dow Chemical Company
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